Slurry Flows

Definition for Slurry Flows-  Definition for Powder Flows-  Definition for Granular Flows

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See our related work on "Particle Augmented Mixed Lubrication" (PAML)

The Slurry Subgroup

Here we’ve developed a 2D proof of concept simulation with sinusoidal
(idealized) pad roughness.

The slurry sub-group studies fluids with nanoparticles in them from a tribological perspective. We are interested in the fluid mechanics, the particle dynamics, and the resulting tribology that occurs when these components exist between sliding surfaces. The study of slurries have strong applications to integrated circuit fabrication (CMP), particulate-fluid lubrication of metal forming processes, suspension dynamics, and many other solid/liquid flows.

Chemical mechanical polishing (CMP) is a slurry-based process commonly used to planarize or polish thin film surfaces to enable stacking of additional levels to enhance lithographic patterning of wafers. After several nano-processing steps (e.g., photolithography, deposition, etc.), it is used to make surfaces atomically smooth and is also an interim step in IC and data storage disk and media manufacturing.

 

 

Particle-Slurry Motion

Higgs III, C.F., Terrell, E., and Garcia, J., “Particulate Flow
Tribological Issues during the CMP of Nanostructures,”
IMIC Conference Proceedings, 2005

 



Wear & Contact Evolution of “Exaggerated Rough” Pad against Aluminum Film

Pad Surface (shown in blue)
H = 7 GPa*
E = 0.3 GPa

Pad Downforce = 10 µN
Sliding Velocity = 1.25 m/s

Aluminum Film
H = 2 GPa
Em = 70 GPa

 


Stress Distribution

HomE    AbouT  [ tribology,  vision,  sponsor,  students,  facilities  ]     ResearcH [ slurry,  powder,  granular ]   
CommunitY [ generation next,  sloan phd,  HBCU pipeline ]    ProfessoR [ webpage,  white papers,  goCarpeDiem ]
StudentS 

The Particle Flow Tribology Lab @ Carnegie Mellon University