Introduction:
In this
example you will learn to model a cooling fin for electronics. This
involves heat generation, conduction and convection.
Physical Problem:
All
electronic components generate heat during the course of their
operation. To ensure optimal working of the component, the generated
heat needs to be removed and thus the electronic component be cooled.
This is done by attaching fins to the device which aid in rapid heat
removal to the surroundings.
Problem Description:
This is
the assembly of the entire fin… analyze only the section of the light
blue
fins
that does not include the base…

Front View
IMPORTANT:
Convert
all dimensions and forces into SI units.
Basic
Outline of the Problem:
Preprocessing:
1.
Start ANSYS.
2. Create areas.
3. Define the
material properties.
4. Define element
type. (Quad
8node 77
element, which is a
2-D element for heat transfer
analysis.)
5.
Specify meshing controls / Mesh the areas to create nodes and elements.
Solution:
6.
Specify boundary conditions.
7.
Solve.
Postprocessing:
8.
List the results of the temperature distribution.
9. Plot the results
of the temperature distribution.
Exit:
10.
Exit the ANSYS program, saving all data.
STARTING ANSYS
Click
on ANSYS 6.1in the programs menu.
Select
Interactive.
The
following menu that comes up. Enter the working directory. All your
files will be stored in this directory. Also enter 64 for Total
Workspace and 32 for Database.
Click
on Run.

MODELING THE STRUCTURE